SiPearl partners with Samsung for built-in HBM in Rhea
SiPearl chooses Italy to open its third international subsidiary
SiPearl unveils key features of the Rhea 1 to accelerate HPC and AI inference
80 Arm Neoverse V1 cores and in-package memory for SiPearl MCU
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
SiPearl’s Rhea1 Delivers Exceptional Compute Performance with 80 Arm Neoverse V1 Cores
SiPearl unveils features of Rhea1 HPC / AI inference processor
SiPearl reveals release date for Rhea-2 HPC chip
SiPearl’s Rhea2 CPU Added to Roadmap: Second-Gen European CPU for HPC
Next Euro HPC Chip Coming Next Year Will Be in 2026 EU Exascale System
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This project has received funding from the European High Performance Computing Joint Undertaking (JU) under Framework Partnership Agreement No 800928 and Specific Grant Agreement No 101036168 (EPI SGA2). The JU receives support from the European Union’s Horizon 2020 research and innovation programme and from Croatia, France, Germany, Greece, Italy, Netherlands, Portugal, Spain, Sweden, and Switzerland.